RRP Electronics inks MoU with AMB, Taiwan for memory modules

RRP Electronics Ltd, a leading semiconductor company, has signed a Memorandum of Understanding (MoU) with AMB, Taiwan, to collaborate on complete technology agreement for memory modules -- SPI NAND, MICROSD, EMMC, and SSD, and production to the tune of $ 25 million to start with initially.

With extended capacities from 2GB onwards, the technology covers complete package structure details, substrate designs, test program development and supporting tool design.

Rajendra Chodankar, Chairman of RRP Electronics, said: “RRP Electronics is excited to partner with AMB, Taiwan. This association which will be deployed immediately at our OSAT facility will have these parts being supplied to Samsung and many leading giant corporates. The OSAT facility, by virtue of this association, promises a $ 25 million revenue per annum in the coming times.”

The company’s 40,000 sq.ft. state of the art OSAT facility at Mahape is operational since September 2024. Besides, the company is going to add more production lines at its new plant at MIDC, Taloja, which is expected to be operational within the next two years.